Researcher(s)
- Christos Madamopoulos, Electrical Engineering, National Technical University of Athens
Faculty Mentor(s)
- Nektarios Tsoutsos, Electrical and Computer Engineering, University of Delaware
Abstract
Securing the cyberspace has evolved as one of the most complex engineering challenges we are facing today. In particular, Side Channel Attacks (SCA) are an increasing threat to different cyber-physical systems. Side channels are methods used to gather information about a system or its operations without directly interacting with the system’s main functionality. These attacks are based on side channel data (e.g., sound), which can be correlated to the system’s main functionality, and hence compromise its security.
The project focuses on the collection of side channel data, i.e., sound and vibration, of 3D printers. The dataset will be published and allow further research in cyber-physical system security and explore the vulnerability of fused deposition modeling to SCAs.
In particular, the project sound and vibration data were collected from two different 3D printers (bambu labs P1P and A1mini), using two different sensor systems. The first method is based on an iPhone, whereas the second one is based on teensy microcontroller. Both systems record sound at 44.1kHz sampling frequency. The vibrations are sampled at 100 Hz and 500 Hz for the iPhone and the teensy 4.0, respectively. Furthermore, a diverse dataset for vibration and iPhone methods are achieved using 11 different artifact designs.